/* Intel PCH thermal Device IDs */ 28: #define PCH_THERMAL_DID_HSW_1 0x9C24 /* Haswell PCH */ 29: #define PCH_THERMAL_DID_HSW_2 0x8C24 /* Haswell PCH */ 30: #define PCH_THERMAL_DID_WPT 0x9CA4 /* Wildcat Point */ 31: #define PCH_THERMAL_DID_SKL 0x9D31 /* Skylake PCH */ 32: #define PCH_THERMAL_DID_SKL_H 0xA131 /* Skylake PCH 100 series */ 33: #define PCH_THERMAL_DID_CNL 0x9Df9 /* CNL PCH */ 34.200 Series PCH Thermal Subsystem: Vendor Device PCI: 8086: Intel Corporation: a2ba: 200 Series PCH CSME HECI #1: Vendor Device PCI: 8086: Intel Corporation: a2bb: 200 Series PCH CSME HECI #2: Vendor Device PCI: 8086: Intel Corporation: a2a0: 200 Series/Z370 Chipset Family P2SB: Vendor Device PCI: 8086: Intel Corporation : a2a1: 200 Series/Z370 Chipset Family Power Management Controller: Vendor. A conductive material used between the component and heatsink to improve thermal conduction. TDP is not the peak power that the PCH can dissipate. Thermal solutions should be designed to dissipate this power level.
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